- Expertini Resume Scoring: Our Semantic Matching Algorithm evaluates your CV/Résumé before you apply for this job role: Process Engineer Wafer Bonder Dicing Grinding.
Urgent! Process Engineer - Wafer-Bonder-Dicing-Grinding Job Opening In Singapore, Singapore – Now Hiring Qualcomm
Join to apply for the
Process Engineer - Wafer-Bonder-Dicing-Grinding
role at
Qualcomm
Job Area : Engineering Group, Engineering Group > Hardware Engineering
Company : RF360 Singapore Pte., Ltd.
General Summary : As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all.
As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products.
Minimum Qualifications :
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Job Responsibilities :
Drive cost reduction by eliminating waste, finding alternative sources, and implementing innovative solutions.
Lead quality investigations and continuous improvement programs to enhance process robustness.
Enforce line controls and ensure adherence to work instructions and procedures.
Apply hands-on involvement in daily operations.
Monitor and analyze SPC charts to drive improvements in process control.
Manage timely disposition of on-hold lots.
Conduct regular reviews and updates of OCAP, FMEA, Control Plans, Risk Assessments, and SIPOC.
Guide and train technicians in process problem-solving and technical competencies.
Demonstrate accountability and foster a strong sense of ownership and teamwork.
Ensure proper handling of non-conformance issues.
Maintain compliance with CSR, EHS, QM, ESD, 5S standards, and cleanroom protocols.
Education/Experience Requirements :
Bachelor’s degree in physics, Chemistry, Materials Science, Electronics, or Electrical Engineering.
Expert in semiconductor processes, with hands-on experience in Wafer-Bonding / Wafer-Dicing / Wafer-Grinding.
Fluent in statistical and quality tools, driving data-backed decisions.
Thrives under pressure, with unwavering commitment to results.
Proficient in MS PowerPoint, Excel, and Word for clear, effective communication.
Skills, Abilities & Knowledge :
Deep expertise in Wafer-fab or Pre-assembly or Backend -assembly - Wafer -Bonding / -Dicing / -Grinding processes, equipment, and materials.
Clear communicator with strong interpersonal skills and a collaborative mindset.
Sharp troubleshooter with a systematic approach to solving complex process issues.
Skilled in SPC and quality tools, driving precision and control.
Dynamic and resourceful, with a creative, self-driven attitude.
Analytical thinker with a knack for organizing data and pinpointing root causes.
Efficient multitasker, able to prioritize and deliver under tight deadlines.
Qualcomm is an equal opportunity employer.
If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process.
#J-18808-Ljbffr
✨ Smart • Intelligent • Private • Secure
Practice for Any Interview Q&A (AI Enabled)
Predict interview Q&A (AI Supported)
Mock interview trainer (AI Supported)
Ace behavioral interviews (AI Powered)
Record interview questions (Confidential)
Master your interviews
Track your answers (Confidential)
Schedule your applications (Confidential)
Create perfect cover letters (AI Supported)
Analyze your resume (NLP Supported)
ATS compatibility check (AI Supported)
Optimize your applications (AI Supported)
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
European Union Recommended
Institution Recommended
Institution Recommended
Researcher Recommended
IT Savvy Recommended
Trades Recommended
O*NET Supported
Artist Recommended
Researchers Recommended
Create your account
Access your account
Create your professional profile
Preview your profile
Your saved opportunities
Reviews you've given
Companies you follow
Discover employers
O*NET Supported
Common questions answered
Help for job seekers
How matching works
Customized job suggestions
Fast application process
Manage alert settings
Understanding alerts
How we match resumes
Professional branding guide
Increase your visibility
Get verified status
Learn about our AI
How ATS ranks you
AI-powered matching
Join thousands of professionals who've advanced their careers with our platform
Unlock Your Process Engineer Potential: Insight & Career Growth Guide
Real-time Process Engineer Jobs Trends in Singapore, Singapore (Graphical Representation)
Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for Process Engineer in Singapore, Singapore using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 30522 jobs in Singapore and 26009 jobs in Singapore. This comprehensive analysis highlights market share and opportunities for professionals in Process Engineer roles. These dynamic trends provide a better understanding of the job market landscape in these regions.
Great news! Qualcomm is currently hiring and seeking a Process Engineer Wafer Bonder Dicing Grinding to join their team. Feel free to download the job details.
Wait no longer! Are you also interested in exploring similar jobs? Search now: Process Engineer Wafer Bonder Dicing Grinding Jobs Singapore.
An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at Qualcomm adheres to the cultural norms as outlined by Expertini.
The fundamental ethical values are:The average salary range for a Process Engineer Wafer Bonder Dicing Grinding Jobs Singapore varies, but the pay scale is rated "Standard" in Singapore. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.
Key qualifications for Process Engineer Wafer Bonder Dicing Grinding typically include Other General and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.
To improve your chances of getting hired for Process Engineer Wafer Bonder Dicing Grinding, consider enhancing your skills. Check your CV/Résumé Score with our free Resume Scoring Tool. We have an in-built Resume Scoring tool that gives you the matching score for each job based on your CV/Résumé once it is uploaded. This can help you align your CV/Résumé according to the job requirements and enhance your skills if needed.
Here are some tips to help you prepare for and ace your job interview:
Before the Interview:To prepare for your Process Engineer Wafer Bonder Dicing Grinding interview at Qualcomm, research the company, understand the job requirements, and practice common interview questions.
Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the Qualcomm's products or services and be prepared to discuss how you can contribute to their success.
By following these tips, you can increase your chances of making a positive impression and landing the job!
Setting up job alerts for Process Engineer Wafer Bonder Dicing Grinding is easy with Singapore Jobs Expertini. Simply visit our job alerts page here, enter your preferred job title and location, and choose how often you want to receive notifications. You'll get the latest job openings sent directly to your email for FREE!